Display Dynamics – April 2025: AUO has introduced a 41.6-inch single LTPS module for Micro LED displays Omdia

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AUO’s three-sided borderless chip-on-film (COF) design reduces the manufacturing cost of panels and modules significantly by eliminating side wiring. However, this solution can only assemble two vertical modules, while side wiring can assemble infinite vertical modules theoretically. AUO should focus on reducing the extra costs of Micro LED displays by manufacturing oxide TFT modules in its Gen 8.5 fab.

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